English | Items | Manufacturing Capabilities | Notes | Patterns |
| Layer count | 1 - 32 layers | Quantity of copper layers on the board | / |
| Impedance | For 4, 6, 8, 10, 12, 14, 16, 18, 20 layers PCB, PCB Stackup designed by PCBWDX(by default), or PCB Stackup designed by customers | Layer Stackup Structure Impedance Calculation Parameter | / |
| Impedance tolerance | ±10% | / | / |
| Material | FR-4 | FR-4: TG130/TG150/TG170 |  |
| PCB material dielectric constant | 4.2 | Prepreg dielectric constant (prepregtype: 7628/1080/2313/2116, dielectric constant: 4.2) | / |
| Max. dimension | 1-2 layers: 500*600mm 4-20 layers: 400*500mm | The maximum dimension that PCBWDX can do |  |
| Min. dimension | Length and width ≥10mm | Min. dimension = 10*10mm | / |
| Dimension tolerance | CNC: ±0.15mm, V-CUT: ±0.2mm | ±0.15mm for CNC routing, and ±0.2mm for V-scoring | / |
| PCB thickness | 0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0/3.2mm | The thickness of finished board |  |
| Thickness tolerance ( Thickness≥1.0mm) | ±10% | e.g. If the board thickness is 1.6mm, the finished board thickness ranges from 1.44mm(1.6-1.6×10%) to 1.76mm(1.6+1.6×10%) | / |
| Thickness tolerance ( Thickness < 1.0mm) | ±0.1mm | e.g. If the board thickness is 0.8mm, the finished board thickness ranges from 0.7mm(0.8-0.1) to 0.9mm(0.8+0.1) | / |
| Finished copper weight | 1 oz/2 oz | Finished copper weight of outer layer could be 1 oz/2 oz |  |
| Inner copper weight | 0.5 oz/1 oz/2 oz | Finished copper weight of inner layer could be 0.5 oz/1 oz/2 oz |  |
| Surface finish | HASL/Lead free HASL/ENIG/OSP | / | / |
| HDI structure | Rank 1 /Rank 2 /Rank 3 | Mechanical blind buried vias or laser blind buried vias(electroplating Via-filling is available) or laser blind vias filling dimple ≤ 15µm | / |
| Electrical test | Flying Probe/Special test fixture | No limits for Flying Probe. Max. 14000 Pads can be tested by PCB test fixture | / |
| Beveling angle of gold finger | 20°/30°/45°/60° | / | / |
| Beveling angle tolerance of gold finger | ±5° | / | / |
| Beveling depth tolerance of gold finger | ±0.1mm | / | / |
| Outline tolerance | ±0.15mm | / | / |
| V-CUT angle | 30°/45°/60° | / | / |
| Number of V-CUT | ≤30 cuts | / | / |
| V-CUT outline size | 55mm ≤ length/width ≤ 480mm | / | / |
| V-CUT residue thickness | 0.25mm ≤ v-cut residue thickness ≤ 0.4mm | / | / |
| Items | Manufacturing Capabilities | Notes | Patterns |
| Drill hole size(Mechanical) | 0.15-6.5mm | Min. drill hole size: 0.15mm(available for PCB thickness ≤ 1.2mm) Max. diameter of drilling bits is 6.5mm(contact support@PCBWDX.com if your customed hole size > 6.5mm) |  |
| Drill hole size tolerance | ≤0.05mm | / | / |
| Blind/Buried vias | Mechanical blind buried vias: copper thickness of blind vias ≥ 20µm | / |  |
| Laser blind buried vias: dimple ≤ 10µm | / |  | |
| Via pad size | ≥0.1 | The pad hole size will be enlarged 0.125mm in production |  |
| PTH hole size | 0.2mm (for single side) | The annular ring size will be enlarged to 0.2mm in production |  |
| Min. non-plated holes | 0.4mm | / |  |
| Min. plated slots | 0.5mm | / |  |
| Min. non-plated slots | 0.5mm | / |  |
| Min. castellated holes | 0.5mm | The minimum diameter of castellated holes is 0.50mm |  |
| Hole size tolerance(Plated) | ±0.075mm | e.g. If customed Plated hole size is 1.000mm, the finished hole size could be between 0.925mm to 1.075mm |  |
| Hole size Tolerance(Non-Plated) | ±0.05mm | e.g. If customed Non-Plated hole size is 1.000mm, the finished hole size could be between 0.95mm to 1.05mm |  |
| Rectangle hole/Slot | With or without fillet angle | / |  |
| Items | Manufacturing Capabilities | Notes | Patterns |
| 1 oz Copper | 3.5mil (single side) (3.5mil≈0.09mm) | / |  |
| 2 oz Copper | 4.5mil (single side) (4.5mil≈0.11mm) | / |
| Items | Manufacturing Capabilities | Patterns |
| Hole to hole clearance(Different nets) | ≥12mil(Avoid conductive anodic filament)(12mil≈0.30mm) |  |
| Via to via clearance(Same nets) | ≥8mil (8mil≈0.20mm) |  |
| SMD pad to SMD pad clearance(Pad without hole, different nets) | ≥0.15mm |  |
| Pad to pad clearance(Pad with hole, different nets) | ≥0.40mm |  |
| Via to track | ≥7mil (7mil≈0.18mm) |  |
| PTH to track | ≥9mil (9mil≈0.23mm) |  |
| NPTH to track | ≥8mil (8mil≈0.20mm) |  |
| SMD pad to track | ≥4mil (4mil≈0.10mm) |  |
| Copper weight | Min. trace width | Min. spacing | Patterns |
| H/HOZ(0.5oz Inner layer) | 2.5mil (2.5mil≈0.06mm) | 3mil (3mil≈0.08mm) |  |
| 1 oz(Outer layer) | 3mil (3mil≈0.08mm) | 3mil (3mil≈0.08mm) | |
| 2 oz(Outer layer) | 5.5mil (5.5mil≈0.14mm) | 5.5mil (5.5mil≈0.14mm) |
| Layer count | Min. BGA pad dimensions | Min. distance between BGA | Min. spacing between the center of two BGAs | Patterns |
| 1 oz | ≥0.2mm | 0.15mm | 0.45mm |  |
| Items | Manufacturing Capabilities | Notes | Patterns |
| Solder mask opening/expansion | ≥1.5mil (1.5mil≈0.04mm) | There should be a minimum size of 1.5mil "solder mask opening" around the pad to allow for any misregistration |  |
| Solder bridge | Green: 3.5mil Black/White: 5mil other solder mask: 4mil | To build solder bridge, the spacing between copper pads edge must be 3.5mils or more |  |
| Solder mask color | Green/Red/Yellow/Blue/White/ Matte Black/Black | / | / |
| Solder mask dielectric constant | 3.5 | / | / |
| Solder mask thickness | Solder mask thickness on base material: 0.8mil, solder mask thickness on copper: 0.6mil | / | / |
| Items | Manufacturing Capabilities | Notes | Patterns |
| Minimum line width | Silkscreen printing≥5mil (5mil≈0.12mm) Printer printing≥3mil (3mil≈0.08mm) | Characters width < 3mil(0.076mm) will be unidentifiable |  |
| Minimum text height | Silkscreen printing≥30mil (30mil≈0.76mm) Printer printing≥24mil (24mil≈0.61mm) | Characters height < 24mil(0.61mm) will be unidentifiable |  |
| Character width to height ratio | ≥ 6:1 | The preferred ratio of width to height is 6:1 | / |
| Pad to silkscreen | >6mil (6mil≈0.15mm) | The minimum distance between pad and silkscreen is 0.15mm |  |
| Items | Manufacturing Capabilities | Notes | Patterns |
| Trace to outline | ≥0.2mm | Individual board(Rounting): Trace to Outline ≥ 0.2mm |  |
| Trace to V-cut line | ≥0.4mm | Panel board with V-scoring: Trace to V-cut line ≥0.4mm |  |
| Items | Manufacturing Capabilities | Notes | Patterns |
| Panelization without space | 0mm | No space between panelized PCBs |  |
| Panelization with space | ≥1.6mm | The space between panelized PCBs should ≥ 1.6mm, if not, the routing process may be difficult and low efficiency |  |
| Panelized round board | ≥80mmx80mm | Stamp Hole: hole size=0.5mm, copper gap=0.35mm, 5-7holes for a set by default |  |
| Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges | The distance between castellated hole and board corner should be > 4mm Recommended diameter of stamp hole is 0.5mm-0.8mm Recommended distance between the two stamp holes is 0.2mm-0.3mm |   |
| Min. width of breakaway tab | ≥4mm | The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm |  |
| Min. edge rails | ≥3mm | If you choose panel by PCBWDX, we will add 3mm edge rails on both sides by default |  |