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High-Density Interconnect Printed Circuit Boards, or HDI PCBs, are advanced circuit boards designed with densely packed components and intricate routing patterns. They utilize microvia technology and advanced manufacturing processes to achieve higher circuit density, smaller vias, and finer traces. HDI PCBs offer enhanced electrical performance, reduced signal loss, and improved reliability in compact electronic devices. With their ability to accommodate high pin counts and complex designs, HDI PCBs are the preferred choice for applications requiring miniaturization and high functionality.
High-Density Interconnect Printed Circuit Boards, or HDI PCBs, are advanced circuit boards designed with densely packed components and intricate routing patterns. They utilize microvia technology and advanced manufacturing processes to achieve higher circuit density, smaller vias, and finer traces. HDI PCBs offer enhanced electrical performance, reduced signal loss, and improved reliability in compact electronic devices. With their ability to accommodate high pin counts and complex designs, HDI PCBs are the preferred choice for applications requiring miniaturization and high functionality.
Here are the advantages and features of HDI PCBS:
Higher Circuit Density: HDI PCBs offer significantly higher circuit density compared to traditional PCBs. They enable the placement of more components in a smaller area, allowing for compact and miniaturized electronic devices.
Smaller Vias and Fine Traces: HDI PCBs utilize advanced microvia technology, which allows for smaller vias and finer traces. This results in improved signal integrity, reduced signal loss, and higher-density interconnects.
Improved Electrical Performance: The reduced size and shorter signal paths in HDI PCBs lead to lower parasitic capacitance and inductance, enhancing electrical performance, signal integrity, and high-speed signal transmission.
Enhanced Reliability: HDI PCBs feature optimized thermal management and reduced electromagnetic interference (EMI), ensuring better reliability and stability in demanding applications.
Design Flexibility: HDI PCBs offer greater design flexibility, enabling the integration of complex circuitry, high pin counts, and advanced features like blind and buried vias, sequential lamination, and microvia stacking.
Wide Range of Applications: HDI PCBs find applications in various industries, including telecommunications, consumer electronics, medical devices, automotive, and aerospace. They are ideal for smartphones, tablets, wearables, high-speed data systems, and other space-constrained electronic products.
Here are the advantages and features of HDI PCBS:
Higher Circuit Density: HDI PCBs offer significantly higher circuit density compared to traditional PCBs. They enable the placement of more components in a smaller area, allowing for compact and miniaturized electronic devices.
Smaller Vias and Fine Traces: HDI PCBs utilize advanced microvia technology, which allows for smaller vias and finer traces. This results in improved signal integrity, reduced signal loss, and higher-density interconnects.
Improved Electrical Performance: The reduced size and shorter signal paths in HDI PCBs lead to lower parasitic capacitance and inductance, enhancing electrical performance, signal integrity, and high-speed signal transmission.
Enhanced Reliability: HDI PCBs feature optimized thermal management and reduced electromagnetic interference (EMI), ensuring better reliability and stability in demanding applications.
Design Flexibility: HDI PCBs offer greater design flexibility, enabling the integration of complex circuitry, high pin counts, and advanced features like blind and buried vias, sequential lamination, and microvia stacking.
Wide Range of Applications: HDI PCBs find applications in various industries, including telecommunications, consumer electronics, medical devices, automotive, and aerospace. They are ideal for smartphones, tablets, wearables, high-speed data systems, and other space-constrained electronic products.
We're capable of manufacturing HDI PCB up to 24 layers in various structures, check the following table for our available HDI PCB structures:
HDI Structures | Type of Micro vias | Mass Production | Small-Middle Batch | Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
staggered vias | |||||
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
stacked vias | |||||
3+N+3 | Blind/Buried | / | Yes | Yes | 8 layers+ |
staggered vias | |||||
3+N+3 | Blind/Buried | / | / | Yes | 8 layers+ |
stacked vias |
Check our HDI PCB capabilities by reviewing the table found below:
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 - 24layers |
Order Quantity | 1pc - 10000+pcs |
Build Time | 2days - 5weeks |
Material | FR4 standard Tg 140℃,FR4 High Tg 170℃, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm - 3.0mm |
Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS | |
ENIG - Electroless Nickle/Immersion Gold - RoHS | |
Immersion Silver - RoHS | |
Immersion Tin - RoHS | |
OSP - Organic Solderability Preservatives - RoHS | |
Min Annular Ring | 4mil, 3mil - laser drill |
Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques | Flex-rigid combination |
Via In Pad | |
Buried Capacitor (only for Prototype PCB total area ≤1㎡) |
We're capable of manufacturing HDI PCB up to 24 layers in various structures, check the following table for our available HDI PCB structures:
HDI Structures | Type of Micro vias | Mass Production | Small-Middle Batch | Prototype | Available |
1+N+1 | Blind vias | Yes | Yes | Yes | 4 layers+ |
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
staggered vias | |||||
2+N+2 | Blind/Buried | Yes | Yes | Yes | 6 layers+ |
stacked vias | |||||
3+N+3 | Blind/Buried | / | Yes | Yes | 8 layers+ |
staggered vias | |||||
3+N+3 | Blind/Buried | / | / | Yes | 8 layers+ |
stacked vias |
Check our HDI PCB capabilities by reviewing the table found below:
Feature | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 4 - 24layers |
Order Quantity | 1pc - 10000+pcs |
Build Time | 2days - 5weeks |
Material | FR4 standard Tg 140℃,FR4 High Tg 170℃, FR4 and Rogers combined lamination |
Board Size | Min 6*6mm | Max 457*610mm |
Board Thickness | 0.4mm - 3.0mm |
Copper Weight (Finished) | 0.5oz - 2.0oz |
Min Tracing/Spacing | 2.5mil/2.5mil |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black, Yellow |
Surface Finish | HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS | |
ENIG - Electroless Nickle/Immersion Gold - RoHS | |
Immersion Silver - RoHS | |
Immersion Tin - RoHS | |
OSP - Organic Solderability Preservatives - RoHS | |
Min Annular Ring | 4mil, 3mil - laser drill |
Min Drilling Hole Diameter | 6mil, 4mil - laser drill |
Max Exponents of Blind/Buried Vias | stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected |
Other Techniques | Flex-rigid combination |
Via In Pad | |
Buried Capacitor (only for Prototype PCB total area ≤1㎡) |
The following are some specific application scenarios of HDI PCBS:
Mobile Devices: HDI PCBs are extensively used in mobile devices such as smartphones, tablets, and smartwatches. Their high-density interconnects and compact design enable the integration of multiple components, including processors, memory, sensors, and connectors.
Data Communication Systems: HDI PCBs play a crucial role in high-speed data communication systems such as network switches, routers, and servers. They enable the efficient transmission of large volumes of data and support the demanding requirements of high-speed and high-bandwidth networks.
Medical Devices: HDI PCBs are utilized in medical devices such as imaging equipment, patient monitoring systems, and diagnostic devices. Their compact size and high-density capabilities enable miniaturized medical devices without compromising performance or reliability.
Automotive Electronics: HDI PCBs are increasingly used in automotive electronics, including infotainment systems, advanced driver-assistance systems (ADAS), and engine control units. Their high-density interconnects and signal integrity features support the growing complexity of automotive electronics.
Consumer Electronics: HDI PCBs are found in various consumer electronic devices, including digital cameras, gaming consoles, smart TVs, and wearable devices. Their compact size and high-performance capabilities enhance the functionality and reliability of these consumer electronics.
Industrial Applications: HDI PCBs are utilized in industrial applications such as industrial control systems, robotics, and automation equipment. Their high-density interconnects and reliable performance make them suitable for complex industrial environments.
The following are some specific application scenarios of HDI PCBS:
Mobile Devices: HDI PCBs are extensively used in mobile devices such as smartphones, tablets, and smartwatches. Their high-density interconnects and compact design enable the integration of multiple components, including processors, memory, sensors, and connectors.
Data Communication Systems: HDI PCBs play a crucial role in high-speed data communication systems such as network switches, routers, and servers. They enable the efficient transmission of large volumes of data and support the demanding requirements of high-speed and high-bandwidth networks.
Medical Devices: HDI PCBs are utilized in medical devices such as imaging equipment, patient monitoring systems, and diagnostic devices. Their compact size and high-density capabilities enable miniaturized medical devices without compromising performance or reliability.
Automotive Electronics: HDI PCBs are increasingly used in automotive electronics, including infotainment systems, advanced driver-assistance systems (ADAS), and engine control units. Their high-density interconnects and signal integrity features support the growing complexity of automotive electronics.
Consumer Electronics: HDI PCBs are found in various consumer electronic devices, including digital cameras, gaming consoles, smart TVs, and wearable devices. Their compact size and high-performance capabilities enhance the functionality and reliability of these consumer electronics.
Industrial Applications: HDI PCBs are utilized in industrial applications such as industrial control systems, robotics, and automation equipment. Their high-density interconnects and reliable performance make them suitable for complex industrial environments.
Q: What is the main advantage of using HDI PCBs?
A: HDI PCBs offer higher circuit density, smaller vias, and finer traces, allowing for compact designs and miniaturized electronic devices with improved performance and reliability.
Q: Can HDI PCBs support high-speed signal transmission?
A: Yes, HDI PCBs are designed to support high-speed signal transmission. Their reduced signal paths and optimized layout help minimize signal loss and maintain signal integrity, making them ideal for high-speed applications.
Q: Are HDI PCBs more expensive than traditional PCBs?
A: HDI PCBs tend to have a higher cost compared to traditional PCBs due to their advanced manufacturing processes and increased complexity. However, the benefits of higher density, improved performance, and space savings often justify the investment.
Q: Can HDI PCBs be manufactured with multiple layers?
A: Yes, HDI PCBs can be manufactured with multiple layers, including 4-layer, 6-layer, 8-layer, or even more, depending on the design requirements. The layer count can be customized to meet the specific needs of the application.
Q: Are HDI PCBs suitable for high-reliability applications?
A: Yes, HDI PCBs are designed for high-reliability applications. Their advanced design techniques, such as microvias and optimized routing, enhance the overall reliability, signal integrity, and thermal management of the PCB, making them suitable for critical and demanding environments.
Q: What is the main advantage of using HDI PCBs?
A: HDI PCBs offer higher circuit density, smaller vias, and finer traces, allowing for compact designs and miniaturized electronic devices with improved performance and reliability.
Q: Can HDI PCBs support high-speed signal transmission?
A: Yes, HDI PCBs are designed to support high-speed signal transmission. Their reduced signal paths and optimized layout help minimize signal loss and maintain signal integrity, making them ideal for high-speed applications.
Q: Are HDI PCBs more expensive than traditional PCBs?
A: HDI PCBs tend to have a higher cost compared to traditional PCBs due to their advanced manufacturing processes and increased complexity. However, the benefits of higher density, improved performance, and space savings often justify the investment.
Q: Can HDI PCBs be manufactured with multiple layers?
A: Yes, HDI PCBs can be manufactured with multiple layers, including 4-layer, 6-layer, 8-layer, or even more, depending on the design requirements. The layer count can be customized to meet the specific needs of the application.
Q: Are HDI PCBs suitable for high-reliability applications?
A: Yes, HDI PCBs are designed for high-reliability applications. Their advanced design techniques, such as microvias and optimized routing, enhance the overall reliability, signal integrity, and thermal management of the PCB, making them suitable for critical and demanding environments.