Professional Durable HDI PCB For Industrial Control
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Professional Durable HDI PCB For Industrial Control

Introducing our HDI (High Density Interconnect) PCB - the ultimate solution for compact electronic devices. 
With its advanced microvia technology, our HDI PCB offers higher signal integrity, reduced signal loss, and increased circuit density. Its miniaturized components and intricate wiring patterns enable smaller, lighter, and more portable electronic devices. Designed for high-speed and high-frequency applications, our HDI PCB ensures efficient power distribution and optimized performance. Whether it's smartphones, tablets, or wearables, our HDI PCB takes your technology to the next level. 
Step into the future of electronics with our cutting-edge HDI PCB today!


High-Density Interconnect Printed Circuit Boards, or HDI PCBs, are advanced circuit boards designed with densely packed components and intricate routing patterns. They utilize microvia technology and advanced manufacturing processes to achieve higher circuit density, smaller vias, and finer traces. HDI PCBs offer enhanced electrical performance, reduced signal loss, and improved reliability in compact electronic devices. With their ability to accommodate high pin counts and complex designs, HDI PCBs are the preferred choice for applications requiring miniaturization and high functionality.


Here are the advantages and features of HDI PCBS:

Higher Circuit Density: HDI PCBs offer significantly higher circuit density compared to traditional PCBs. They enable the placement of more components in a smaller area, allowing for compact and miniaturized electronic devices.

Smaller Vias and Fine Traces: HDI PCBs utilize advanced microvia technology, which allows for smaller vias and finer traces. This results in improved signal integrity, reduced signal loss, and higher-density interconnects.

Improved Electrical Performance: The reduced size and shorter signal paths in HDI PCBs lead to lower parasitic capacitance and inductance, enhancing electrical performance, signal integrity, and high-speed signal transmission.

Enhanced Reliability: HDI PCBs feature optimized thermal management and reduced electromagnetic interference (EMI), ensuring better reliability and stability in demanding applications.

Design Flexibility: HDI PCBs offer greater design flexibility, enabling the integration of complex circuitry, high pin counts, and advanced features like blind and buried vias, sequential lamination, and microvia stacking.

Wide Range of Applications: HDI PCBs find applications in various industries, including telecommunications, consumer electronics, medical devices, automotive, and aerospace. They are ideal for smartphones, tablets, wearables, high-speed data systems, and other space-constrained electronic products.

We're capable of manufacturing HDI PCB up to 24 layers in various structures, check the following table for our available HDI PCB structures:

HDI StructuresType of Micro viasMass ProductionSmall-Middle BatchPrototypeAvailable
1+N+1Blind viasYesYesYes4 layers+
2+N+2Blind/BuriedYesYesYes6 layers+
staggered vias
2+N+2Blind/BuriedYesYesYes6 layers+
stacked vias
3+N+3Blind/Buried/YesYes8 layers+
staggered vias
3+N+3Blind/Buried//Yes8 layers+
stacked vias

Check our HDI PCB capabilities by reviewing the table found below:

Quality GradeStandard IPC 2
Number of Layers4 - 24layers
Order Quantity1pc - 10000+pcs
Build Time2days - 5weeks
MaterialFR4 standard Tg 140℃,FR4 High Tg 170℃, FR4 and Rogers combined lamination
Board SizeMin 6*6mm | Max 457*610mm
Board Thickness0.4mm - 3.0mm
Copper Weight (Finished)0.5oz - 2.0oz
Min Tracing/Spacing2.5mil/2.5mil
Solder Mask SidesAs per the file
Solder Mask ColorGreen, White, Blue, Black, Red, Yellow
Silkscreen SidesAs per the file
Silkscreen ColorWhite, Black, Yellow
Surface FinishHASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS
Min Annular Ring4mil, 3mil - laser drill
Min Drilling Hole Diameter6mil, 4mil - laser drill
Max Exponents of Blind/Buried Viasstacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Other TechniquesFlex-rigid combination
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1㎡)

The following are some specific application scenarios of HDI PCBS:

Mobile Devices: HDI PCBs are extensively used in mobile devices such as smartphones, tablets, and smartwatches. Their high-density interconnects and compact design enable the integration of multiple components, including processors, memory, sensors, and connectors.

Data Communication Systems: HDI PCBs play a crucial role in high-speed data communication systems such as network switches, routers, and servers. They enable the efficient transmission of large volumes of data and support the demanding requirements of high-speed and high-bandwidth networks.

Medical Devices: HDI PCBs are utilized in medical devices such as imaging equipment, patient monitoring systems, and diagnostic devices. Their compact size and high-density capabilities enable miniaturized medical devices without compromising performance or reliability.

Automotive Electronics: HDI PCBs are increasingly used in automotive electronics, including infotainment systems, advanced driver-assistance systems (ADAS), and engine control units. Their high-density interconnects and signal integrity features support the growing complexity of automotive electronics.

Consumer Electronics: HDI PCBs are found in various consumer electronic devices, including digital cameras, gaming consoles, smart TVs, and wearable devices. Their compact size and high-performance capabilities enhance the functionality and reliability of these consumer electronics.

Industrial Applications: HDI PCBs are utilized in industrial applications such as industrial control systems, robotics, and automation equipment. Their high-density interconnects and reliable performance make them suitable for complex industrial environments.

Q: What is the main advantage of using HDI PCBs?

A: HDI PCBs offer higher circuit density, smaller vias, and finer traces, allowing for compact designs and miniaturized electronic devices with improved performance and reliability.

Q: Can HDI PCBs support high-speed signal transmission?

A: Yes, HDI PCBs are designed to support high-speed signal transmission. Their reduced signal paths and optimized layout help minimize signal loss and maintain signal integrity, making them ideal for high-speed applications.

Q: Are HDI PCBs more expensive than traditional PCBs?

A: HDI PCBs tend to have a higher cost compared to traditional PCBs due to their advanced manufacturing processes and increased complexity. However, the benefits of higher density, improved performance, and space savings often justify the investment.

Q: Can HDI PCBs be manufactured with multiple layers?

A: Yes, HDI PCBs can be manufactured with multiple layers, including 4-layer, 6-layer, 8-layer, or even more, depending on the design requirements. The layer count can be customized to meet the specific needs of the application.

Q: Are HDI PCBs suitable for high-reliability applications?

A: Yes, HDI PCBs are designed for high-reliability applications. Their advanced design techniques, such as microvias and optimized routing, enhance the overall reliability, signal integrity, and thermal management of the PCB, making them suitable for critical and demanding environments.


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