High Precision HDI PCB For Electrical Products
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High Precision HDI PCB For Electrical Products

High Precision HDI PCB For Electrical Products is a type of printed circuit board designed for high-density and high-performance electronic products.
HDI (High Density Interconnect) technology allows for the creation of complex and compact circuits with multiple layers, fine lines, and small vias. This type of PCB is suitable for various electrical products, such as smartphones, tablets, and cameras, with a high requirement for miniaturization, high-speed signal transmission, and high reliability. The high precision of HDI PCB ensures excellent electrical performance and signal integrity, which is critical for the performance of the end product.
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High Precision HDI PCB: Unmatched performance and reliability for electrical products.

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  • High Precision Design: Our PCBs are meticulously designed to ensure accuracy and stability in circuitry. This results in improved signal integrity and reduced signal loss, guaranteeing the smooth operation of electronic devices.

  • Microvia Technology: Our HDI PCBs utilize microvia technology to achieve higher circuit densities. The microvia interconnects allow components to be connected on multiple layers, enabling smaller form factors and enhanced performance in electronic products.

  • High-Speed Applications: Our HDI PCBs are ideal for high-speed applications, including high-frequency signal transmission and rapid data processing. Optimized power distribution and precise signal transmission enable electronic devices to achieve fast and stable high-speed communication and data exchange.

  • Superior Performance: With superior performance, our HDI PCBs provide stable power supply and optimized signal transmission. This not only enhances the overall performance of electronic products but also extends their service life.

  • Versatility for Various Electronic Devices: Our HDI PCBs are suitable for a wide range of electronic devices, such as smartphones, tablets, smartwatches, and more. We offer customizable options to meet the specific design and functional requirements of different products.

In summary, our High Precision HDI PCBs are advanced technologies designed for electronic products. Whether you are designing new products or upgrading existing ones, our HDI PCBs enable you to achieve smaller, lighter, and higher-performing electronic devices.


Revolutionary HDI PCB: Elevating Electrical Product Performance


  • Enhanced Signal Integrity: Our High Precision HDI PCBs are designed with advanced manufacturing techniques and materials to minimize signal loss and interference. This results in improved signal integrity, ensuring accurate and reliable operation of electrical products.

  • Increased Component Density: With the use of microvia technology and intricate layer stacking, our HDI PCBs allow for higher component density on a smaller footprint. This enables designers to create more compact and space-efficient electrical products without compromising performance.

  • Improved Power Distribution: Our HDI PCBs feature optimized power distribution networks that ensure stable and efficient power delivery to all components. This leads to improved performance and reliability of electrical products, preventing issues such as voltage drops and overheating.

  • High-Speed Data Transmission: Our HDI PCBs are designed to handle high-speed data transmission with minimal loss and distortion. They provide low crosstalk and impedance control, allowing for reliable communication and data exchange in electrical products.

  • Enhanced Thermal Management: Our HDI PCBs are engineered with thermal management techniques to efficiently dissipate heat generated by components. This prevents overheating and ensures the longevity and reliability of electrical products, especially those operating in demanding conditions.

  • Customization and Flexibility: Our High Precision HDI PCBs can be customized to meet specific design requirements, allowing for flexibility in product development. Whether it's a complex multilayer design, rigid-flex PCB, or any other customization, we can provide tailored solutions to suit your electrical product needs.


Overall, the advantages of our High Precision HDI PCBs for electrical products include enhanced signal integrity, increased component density, improved power distribution, high-speed data transmission capabilities, efficient thermal management, and customization options. These benefits contribute to the overall performance, reliability, and longevity of electrical products in various applications and industries alike.


Layer
2-10 Layers
Max.Board Thickness
8.5mm
Surface Finish
ENIG
OSP
HASL
Immersion tin
Immersion silver
Copper Thickness
0.5 oz-2 oz
Min. Board Thickness
2L:0.3mm
4L:0.4mm
6L:0.8mm
Min Inner Layer Clearance
0.1mm(4mil)
Min Line width
0.075mm(3/3 mil)
Min Line space
0.075mm(3/3 mil)
Min.Hole Size
0.15mm(6mil)
Min plated hole thickness
20um(0.8mil)
Min Blind/Buried hole size
0.1mm(4mil)
Silkscreen color
White
Yellow
Red
Black
Outline
Routing
V-Groove
Beveling punch
Solder mask color
Green
black
Blue
White
Yellow
Red
Outline Tolerance
±0.15mm ±6mil
Flammability
94V-0
Test Voltage
50-330V

HDI PCBs have various applications across different industries due to their high-density capabilities and advanced technologies. Some common product applications of HDI PCBs include:


Smartphones: HDI PCBs are widely used in smartphones due to their compact size and high-performance requirements. They enable the integration of complex circuits, multilayer routing, and miniaturization of electronic components.


Tablets and Laptops: HDI PCBs are used in tablets and laptops for similar reasons as smartphones. They allow for space-efficient designs, high-speed data transmission, and reliable connectivity for components such as processors, memory chips, and display modules.


Wearable Devices: The compact size and high functionality of HDI PCBs make them an ideal choice for wearable devices like smartwatches, fitness trackers, and medical monitoring devices. These PCBs enable lightweight and flexible designs, as well as reliable interconnections between sensors, batteries, and displays.


Automotive Electronics: HDI PCBs are increasingly used in automotive applications, where space is limited, and reliability is crucial. They are employed in advanced driver assistance systems (ADAS), infotainment systems, digital dashboards, and control units, enabling higher performance and improved functionality.


Aerospace and Defense: HDI PCBs find applications in aerospace and defense electronics, where miniaturization, reliability, and high performance are critical. They are employed in avionics systems, radar equipment, communication devices, and missile guidance systems, among others.


Medical Devices: HDI PCBs are utilized in medical devices like ultrasound machines, patient monitoring systems, and diagnostic equipment. These PCBs offer compact designs, high-density interconnections for sensors and data processing, and stringent quality standards for medical device manufacturing.


Industrial Electronics: HDI PCBs are used in industrial applications, such as factory automation systems, robotics, and control units. These PCBs enable high-speed data transmission, precise control, and ruggedness to withstand harsh environmental conditions.


IoT Devices: The Internet of Things (IoT) devices require small form factors, low power consumption, and high connectivity. HDI PCBs meet these requirements and are used in IoT applications like smart home devices, industrial sensors, and wearable technology.Overall, HDI PCBs find extensive applications in various industries, primarily due to their ability to accommodate complex circuits in a small footprint, provide high-density interconnections, and enable reliable and efficient performance.

FAQs
  • What is a high precision HDI PCB?
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    A high-density interconnect (HDI) PCB is a circuit board that utilizes advanced technologies and design techniques to achieve a higher density of electronic components and interconnections. High precision HDI PCBs are specifically manufactured with extremely tight tolerances and strict quality control to ensure accuracy and precision in their fabrication.
  • What are the advantages of using high precision HDI PCB in electrical products?
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    High precision HDI PCB offer numerous advantages, including:
    Improved circuit density: HDI PCB allow for the integration of more electronic components in a smaller space, enabling smaller and more compact devices.
    Enhanced electrical performance: The shorter signal paths and reduced noise interference in HDI PCBs result in improved signal integrity and higher-speed data transmission.
    Increased reliability: HDI PCB follow strict manufacturing processes, ensuring high-quality construction and robust soldering connections, leading to increased reliability and reduced failure rates.
    Lower power consumption: The compact design of HDI PCB reduces power losses and enhances power distribution efficiency, resulting in lower energy consumption.
    Cost-effectiveness: Although the manufacturing process of HDI PCB may be more complex, their ability to reduce component count and support advanced functionalities can lead to overall cost savings in the product design.
  • Can high precision HDI PCB be used in various electrical products?
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    Yes, high precision HDI PCBs have versatile applications and can be used in a wide range of electrical products. These include smartphones, tablets, laptops, wearable devices, automotive electronics, aerospace and defense equipment, medical devices, industrial electronics, IoT devices, and more.
  • What design considerations are important for  HDI PCB?
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    Design considerations for high precision HDI PCBs include:
    Pad and trace geometry: The design should ensure adequate spacing between pads and traces to minimize the risk of short circuits or signal interference.
    Layer stackup and interconnect structure: Proper layer stackup and interconnect design are crucial to achieving high density and efficient signal routing.
    Signal integrity: Careful attention should be given to impedance control, controlled impedance traces, and minimizing signal crosstalk to maintain signal integrity.
    Thermal management: Efficient heat dissipation mechanisms, such as properly placed vias and heat sinks, should be considered to prevent overheating and ensure optimal performance.
    Component placement and routing: Placement and routing should be optimized to minimize signal delays, reduce signal lengths, and achieve efficient power distribution.
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