| Items | Processing Capabilities | Process Details |
| Number of Layers | 2 – 32 layers | Mainly produce high multi-layer (6 – 24 layers) and high multi-order HDI boards. |
| Type of Plate Material | Medium and high TG high-speed and high-frequency materials | Main plate material suppliers: SY, EMC/TUC/ISOLA/ROGERS/Taiwan Nanya |
| Maximum Size | 540X620mm | |
| Precision of Outline Dimensions | ±0.1mm | Tolerance for special outlines: ±0.075mm |
| Board Thickness Range | 0.2 — 3.2mm | Special board thickness can reach 4.0mm |
| Board Thickness Tolerance (t≥1.0mm) | ± 10% | |
| Board Thickness Tolerance (t<1.0mm) | ±0.1mm | |
| Minimum Line Width | 2mil (0.050mm) | Special: 1.7mil |
| Minimum Clearance | 2mil (0.050mm) | Special: 1.7mil |
| Finished Outer-layer Copper Thickness | Maximum: 4OZ | Special: up to 5OZ |
| Finished Inner-layer Copper Thickness | Maximum: 4OZ | Special: up to 5OZ |
| Drilled Hole Diameter (Machine Drilling) | 0.15–6.3mm | |
| Single-Side Solder Ring of Through Hole | ≥0.075 (3mil) | |
| Finished Hole Diameter (Machine Drilling) | 0.1–6.20mm | Laser: 0.1mm (min), Mechanical: 0.15mm (min) |
| Tolerance of Hole Diameter (Machine Drilling) | ±0.075mm | Crimping hole: +/-0.05mm |
| Type of Solder Mask | Photosensitive ink | |
| Minimum Character Width | ≥0.125mm | The minimum width of the character. If it is less than 0.125mm, the character on the physical board may be unclear due to design reasons. |
| Minimum Character Height | ≥0.7mm | The minimum height of the character. If it is less than 0.7mm, the character on the physical board may be unclear due to design reasons. |
| Character Width-to-Height Ratio | 1:5 | The most suitable width-to-height ratio which is more conducive to production. |
| Spacing between Traces and Outline | ≥0.3mm (12mil) | For the board shipped by routing, the distance between the traces in the circuit layer and the outline of the board should not be less than 0.3mm; for the V-cut assembled board shipped, the distance between the traces and the center line of the V-cut should not be less than 0.4mm. |
| Gap of Gapless Panelization | 0 gap panelization | V-CUT |
| Gap of Panelization with Gap | 1.6mm | The gap of panelization with the gap should not be less than 1.6mm; it will be more difficult during the routing of the edge. |
| Copper Pouring Method of Pads Manufacturer | Copper pouring in Hatch mode | |
| Drawing Grooves in Pads Software | Use the Drill Drawing layer | |
| Soldermask Layer in Protel/dxp Software | Solder layer | |
| Outline Layer in Protel/dxp | Use the Keepout layer or the Mechanical layer. | Please note: Only one outline layer is allowed in one file, and it is absolutely not allowed to have two outline layers at the same time. Please delete the unused outline layer; that is, only one of the Keepout layer or the Mechanical layer can be selected when outlining. |
| Minimum Half-hole Diameter of Half-hole Process | 0.2mm | |
| Solder Mask Bridge | 0.075mm | Green solder mask bridge: 0.075mm, Miscellaneous color ink: 0.113mm |
Utilizing the latest SMT and through-hole equipment and processes, our experienced staff can produce high-quality, reliable products on schedule, handling everything from prototypes to high-volume assembly.
We offer a comprehensive one-stop solution for PCB manufacturing and assembly. We manage the entire process from PCB fabrication to assembly, eliminating the need for you to coordinate multiple suppliers. Send us your design files, and we’ll deliver fully assembled, fully functional printed circuit boards.
PCBWDX is committed to delivering the highest quality printed circuit boards at the most competitive prices. We strive to provide exceptional service for all orders, whether you require simple prototypes, volume production, or time-sensitive, technically complex multilayer PCB products. Our manufacturing adheres to IPC standards and complies with ISO9001:2015 and RoHS/REACH regulations.
PCBWDX manufactures PCBs using diverse materials, including traditional FR4, high-Tg FR4, high-frequency FR4, high-speed FR4, halogen-free FR4, polyimide, ceramic, aluminum oxide, high-thermal-conductivity materials, aluminum/copper-based materials, PTFE, and more. PCB surface finishes include HASL, ENIG, ENEPIG, OSP, Immersion Gold/Tin/Silver, Hard Gold Plating, Soft Gold Plating, Carbon Ink, Blue Film, and more.
FR-4: Epoxy resin and glass fiber cloth substrate, most commonly used, cost-effective, suitable for most electronic products.
High Tg FR-4: FR-4 with a high glass transition temperature, better high-temperature resistance.
Paper-based (FR-1, XPC): Phenolic resin impregnated wood pulp paper, low cost, easy to punch, but not resistant to high temperatures, mostly used in low-end products.
CEM series (CEM-1, CEM-3): Composite substrate, combining paper and glass cloth, offering a balance of cost and performance.
Polyimide (PI): High temperature resistant and flexible, suitable for mobile phones, cameras, and aerospace applications.
Polytetrafluoroethylene (PTFE)/Teflon: Low dielectric constant, suitable for high-frequency/radio frequency applications, such as microwave oven circuits.
PTFE/Teflon Substrate: Low loss, good high-frequency performance.
LCP (Liquid Crystal Polymer): Commonly used in high-speed communication fields.
Ceramic Substrate: Extremely high thermal conductivity, used in high-power LEDs and power modules.
Metal Substrate (Aluminum, Copper Substrate): Metal core, excellent heat dissipation, used in LED lighting and automotive electronics.
ISO9001-certified, we prioritize customer needs with full-process, strict QC from sourcing to delivery, ensuring compliant PCB quality and customer peace of mind.
With our comprehensive capabilities, we provide you with a one-stop PCB solution from prototyping to mass production, and from design to assembly, balancing quality, efficiency, and cost to help your project succeed.
FR4 is a glass-fiber reinforced epoxy laminate that meets the UL 94V-0 standard. FR4 material is the most commonly used PCB material in electronic products.
It is an enhanced FR4 material capable of withstanding higher temperatures during both processing and use.
This is an environmentally friendly FR4 substrate that is free of or contains low levels of halogens such as bromine and chlorine. It produces low toxicity during combustion, is environmentally friendly, and maintains performance similar to standard FR4.
Glass fiber-reinforced or polytetrafluoroethylene-reinforced ceramic materials are used in the production of high-frequency, high-speed printed circuit boards.
This material is made of polyimide and can be repeatedly bent or folded. It is commonly used in the production of flexible printed circuit boards and rigid-flex printed circuit boards.
It is a material with high thermal conductivity, typically used in high-power lighting products or products requiring extremely high heat dissipation rates.
